Board-level repair & microsoldering
Work at the component level, under the microscope, not part-swapping.
Most shops replace a whole board. We repair the board itself. Faults are traced with a schematic, a bench supply and a thermal camera until the exact failing component is found, then that component, sometimes smaller than a grain of rice, is replaced under a stereo microscope. It costs a fraction of a board swap, and on equipment where a replacement board is simply not sold any more, it is the only route there is.
What this involves
- Shorted rails, dead power ICs and burnt supply circuits traced on the board
- BGA reballing and chip reflow, including processors, graphics and power-management ICs
- Broken pads and lifted traces rebuilt with jumper wire
- Corrosion and liquid damage cleaned ultrasonically, then repaired
